When the packing density is permissible, choosing a lower-density routing design to improve reliability and defect-free manufacturing capacity.

The design of through hole needs to meet the requirement that the hole diameter to the panel thickness ratio should be greater than 1/6.

 

Cylindrical component bonding pad design - The shape of bonding pad is rectangle. When the reflow soldering process is applied, a concave groove must be designed

Cylindrical component bonding pad design - The shape of bonding pad is rectangle. When the reflow soldering process is applied, a concave groove must be designed

 

Care should be taken to distinguish between single ended and differential trace impedance. High speed single ended signals need to be routed with the specified single ended impedance.