News — Design

  • PCB Routing Requirements
    June 11, 2015

    PCB Routing Requirements

    When the packing density is permissible, choosing a lower-density routing design to improve reliability and defect-free manufacturing capacity.
  • Design of Hole
    June 08, 2015

    Design of Hole

    The design of through hole needs to meet the requirement that the hole diameter to the panel thickness ratio should be greater than 1/6.

     

  • Bonding Pad Design Ⅱ
    April 05, 2015

    Bonding Pad Design Ⅱ

    Cylindrical component bonding pad design - The shape of bonding pad is rectangle. When the reflow soldering process is applied, a concave groove must be designed
  • Bonding Pad Design Ⅰ
    April 05, 2015

    Bonding Pad Design Ⅰ

    Cylindrical component bonding pad design - The shape of bonding pad is rectangle. When the reflow soldering process is applied, a concave groove must be designed

     

  • Trance Impedance
    April 03, 2015

    Trance Impedance

    Care should be taken to distinguish between single ended and differential trace impedance. High speed single ended signals need to be routed with the specified single ended impedance.