News
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June 10, 2015PCB Routing Requirements
When the packing density is permissible, choosing a lower-density routing design to improve reliability and defect-free manufacturing capacity. -
June 08, 2015Design of Hole
The design of through hole needs to meet the requirement that the hole diameter to the panel thickness ratio should be greater than 1/6. -
April 14, 2015SpaceHarp has gone live on Indiegogo
SpaceHarp is one of our customers announced that their campaign has gone live on Indiegogo and announced NexPCB is their manufacturer. Motion-Controlled Music Instrument which is SpaceHarp crowdfunding product and it seems to us is very interesting. -
April 07, 2015NexPCB Supports Indiegogo Campaigns
NexPCB is the recommended Indiegogo EMS provider at Indiegogo's Hardware Handbook. And we sincerely to announce to offer 10% discount for your campaign in partnership with NexPCB.
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April 05, 2015Bonding Pad Design Ⅱ
Cylindrical component bonding pad design - The shape of bonding pad is rectangle. When the reflow soldering process is applied, a concave groove must be designed
