News
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June 10, 2015
PCB Routing Requirements
When the packing density is permissible, choosing a lower-density routing design to improve reliability and defect-free manufacturing capacity. -
June 08, 2015
Design of Hole
The design of through hole needs to meet the requirement that the hole diameter to the panel thickness ratio should be greater than 1/6. -
April 14, 2015
SpaceHarp has gone live on Indiegogo
SpaceHarp is one of our customers announced that their campaign has gone live on Indiegogo and announced NexPCB is their manufacturer. Motion-Controlled Music Instrument which is SpaceHarp crowdfunding product and it seems to us is very interesting. -
April 07, 2015
NexPCB Supports Indiegogo Campaigns
NexPCB is the recommended Indiegogo EMS provider at Indiegogo's Hardware Handbook. And we sincerely to announce to offer 10% discount for your campaign in partnership with NexPCB.
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April 05, 2015
Bonding Pad Design Ⅱ
Cylindrical component bonding pad design - The shape of bonding pad is rectangle. When the reflow soldering process is applied, a concave groove must be designed