News

  • PCB Routing Requirements
    June 10, 2015

    PCB Routing Requirements

    When the packing density is permissible, choosing a lower-density routing design to improve reliability and defect-free manufacturing capacity.
  • Design of Hole
    June 08, 2015

    Design of Hole

    The design of through hole needs to meet the requirement that the hole diameter to the panel thickness ratio should be greater than 1/6.

     

  • SpaceHarp has gone live on Indiegogo
    April 14, 2015

    SpaceHarp has gone live on Indiegogo

    SpaceHarp is one of our customers announced that their campaign has gone live on Indiegogo and announced NexPCB is their manufacturer. Motion-Controlled Music Instrument which is SpaceHarp crowdfunding product and it seems to us is very interesting.
  • NexPCB Supports Indiegogo Campaigns
    April 07, 2015

    NexPCB Supports Indiegogo Campaigns

    NexPCB is the recommended Indiegogo EMS provider at  Indiegogo's Hardware Handbook.  And we sincerely to announce to offer 10% discount for your campaign in partnership with NexPCB. 

     

  • Bonding Pad Design Ⅱ
    April 05, 2015

    Bonding Pad Design Ⅱ

    Cylindrical component bonding pad design - The shape of bonding pad is rectangle. When the reflow soldering process is applied, a concave groove must be designed