Capabilities and Services offered:

  1. Assembly drawings, fabrication drawings 
  2. Board layout from a customer supplied schematic diagram 
  3. Controlled impedance (single and differential) designs 
  4. Layout for RF designs 
  5. High Speed Backplane and Mid-plane Designs/Micro BGA / Micro via/ Blind & Buried 
  6. Multi-layer boards, split ground planes, differential pairs, high speed rules 
  7. Routing per trace/space, keep-out, and clearance rules specified by customer 
  8. DFT audit, test point placement, test probe clearance. 


  1. Documents with all relevant details and manufacturing guidelines 
  2. Schematic - pdf format 
  3. PCB Netlist - text format 
  4. Assembly Drawing - .pdf OR gerber format 
  5. PDF copies of all board layer images 
  6. Gerber Data for all electrical and non-electrical layers in 274X, 2,3 English format 
    OR customer specified format